ENVIRONMENTAL ACCEPTANCE REQUIREMENTS FOR TIN WHISKER SUSCEPTIBILITY OF TIN AND TIN ALLOY SURFACE FINISHED
standard by JEDEC Solid State Technology Association, 08/01/2008
JEDEC JESD 8-20A
POD15 – 1.5 V Pseudo Open Drain I/O
standard by JEDEC Solid State Technology Association, 10/01/2009
JEDEC JESD 22-B105C (R2006)
LEAD INTEGRITY
standard by JEDEC Solid State Technology Association, 05/01/2003
JEDEC JESD79-3-1A
Addendum No. 1 to JESD79-3 – 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, and DDR3L-1600
Amendment by JEDEC Solid State Technology Association, 01/01/2013
JEDEC JEP144A
GUIDELINE FOR RESIDUAL GAS ANALYSIS (RGA) FOR MICROELECTRONIC PACKAGES
standard by JEDEC Solid State Technology Association, 11/01/2011
JEDEC JESD28-1
N-CHANNEL MOSFET HOT CARRIER DATA ANALYSIS
standard by JEDEC Solid State Technology Association, 09/01/2001
JEDEC JESD22-A117E
ELECTRICALLY ERASABLE PROGRAMMABLE ROM (EEPROM) PROGRAM/ERASE ENDURANCE AND DATA RETENTION TEST
standard by JEDEC Solid State Technology Association, 11/01/2018
JEDEC JESD30G
Descriptive Designation System for Semiconductor-device Packages
standard by JEDEC Solid State Technology Association, 01/01/2016
JEDEC JESD22-A111B
EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES
standard by JEDEC Solid State Technology Association, 03/01/2018
JEDEC JESD22-B119
MECHANICAL COMPRESSIVE STATIC STRESS TEST METHODS
standard by JEDEC Solid State Technology Association, 10/01/2018