Half Price Standard Code

THERMAL TEST ENVIRONMENT MODIFICATIONS FOR MULTICHIP PACKAGES
standard by JEDEC Solid State Technology Association, 07/01/2008

I/O DRIVERS AND RECEIVERS WITH CONFIGURABLE COMMUNICATION VOLTAGE, IMPEDANCE, AND RECEIVER THRESHOLD
standard by JEDEC Solid State Technology Association, 02/01/1999

STANDARD FOR DESCRIPTION OF 54/74ABTXXX AND 74BCXXX TTL-COMPATIBLE BiCMOS LOGIC DEVICES
standard by JEDEC Solid State Technology Association, 02/01/1996

GUIDELINE FOR RESIDUAL GAS ANALYSIS (RGA) FOR MICROELECTRONIC PACKAGES
standard by JEDEC Solid State Technology Association, 07/01/2002

POD125 – 1.25 V PSEUDO OPEN DRAIN I/O
standard by JEDEC Solid State Technology Association, 09/01/2017

INTERFACE TEST METHOD FOR THE MEASUREMENT OF THE THERMAL RESISTANCE JUNCTION-TO-CASE OF SEMICONDUCTOR DEVICES WITH HEAT FLOW TROUGH A SINGLE PATH
standard by JEDEC Solid State Technology Association, 11/01/2010

TEST METHODS AND ACCEPTANCE PROCEDURES FOR THE EVALUATION OF POLYMERIC MATERIALS
standard by JEDEC Solid State Technology Association, 03/01/2018

POWER AND TEMPERATURE CYCLING
standard by JEDEC Solid State Technology Association, 01/01/2004

Embedded Multi-media card (e*MMC), Electrical Standard 4.51
standard by JEDEC Solid State Technology Association, 06/01/2012

Implementation of the Electrical Test Method for the Measurement of Real Thermal Resistance and Impedance of Light-emitting Diodes with Exposed Cooling Surface
standard by JEDEC Solid State Technology Association, 04/18/2012