Design and Assembly Process Implementation for Bottom Termination Components
standard by Association Connecting Electronics Industries, 03/28/2011
IPC A-610F – Amendment 1
Acceptability of Electronic Assemblies – Amendment 1
Amendment by Association Connecting Electronics Industries, 12/01/2015
IPC J-STD-006C
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
standard by Association Connecting Electronics Industries, 07/01/2013
IPC A-610F-WAM1
Acceptability of Electronic Assemblies – Incorporates Amendment 1
standard by Association Connecting Electronics Industries, 02/01/2016
IPC DRM-18H
Component Identification Training and Reference Guide
standard by Association Connecting Electronics Industries, 12/01/2007
IPC A-610F
Acceptability of Electronic Assemblies
standard by Association Connecting Electronics Industries, 07/01/2014
IPC D-310C
Guidelines for Phototool Generation and Measurement Techniques
Handbook / Manual / Guide by Association Connecting Electronics Industries, 06/01/1991
IPC D-859
Design Standard for Thick Film Multilayer Hybrid Circuits
standard by Association Connecting Electronics Industries, 12/01/1989
IPC A-600G
Acceptability of Printed Boards
standard by Association Connecting Electronics Industries, 07/01/2004
IPC TMRC-00T
2000 Technology Trends for Printed Wiring Boards
Report / Survey by Association Connecting Electronics Industries, 01/01/2000